The polishing pad (104) is useful for polishing at least one of a magnetic, optical and semiconductor substrate (112) in the presence of a polishing medium (120). The polishing pad 104 includes multiple layers of polishing filaments (200, 300, 400, 500) stacked on a base layer (204, 404, 504) of polishing...http://www.google.se/patents/US7517277?utm_source=gb-gplus-sharePatent US7517277 - Layered-filament lattice for chemical mechanical polishing
Layered-filament lattice for chemical mechanical polishing
