(54) LIGHT-EMITTING MODULE
(75) Inventor: George E. Matheson, North Vancouver (CA)
(73) Assignee: TIR Technology LP, Burnaby, British Columbia (CA)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 11/419,292
(22) Filed: May 19, 2006
(65) Prior Publication Data
US 2006/0284199 Al Dec. 21, 2006
Related U.S. Application Data
(60) Provisional application No. 60/683,244, filed on May 20, 2005.
(51) Int. CI.
H01L 29/22 (2006.01)
H01L 29/24 (2006.01)
H01L 33/00 (2006.01)
(52) U.S. CI 257/98; 257/99; 257/100;
257/678; 257/680; 257/684; 257/706; 257/707; 257/718; 257/E23.086; 257/E23.088; 257/E23.103;
257/E25.032
(58) Field of Classification Search 257/81,
257/83, 98-100, 116, 177, 431-433, 678-733, 257/E23.001-E23.194, E25.032 See application file for complete search history.
(56) References Cited
U.S. PATENT DOCUMENTS
The light-emitting module according to the present invention comprises a heat dissipation element, a substrate for example a metal core printed circuit board (MCPCB), or FR4 board which is coupled to one or more light-emitting elements and provides a means for operative connection of the light-emitting elements to a source of power. The substrate is positioned such that it is thermally coupled to the heat dissipation element. The light-emitting module further comprises a housing element which matingly connects with the heat dissipation element, wherein the housing element may further comprise an optical element integrated therein for manipulation of the light generated by the one or more light-emitting elements.
15 Claims, 5 Drawing Sheets
