Multi-layer printed wiring board, electronic device, and fabrication method ...

(22) Filed: Dec. 24, 2008 (65) Prior Publication Data US 2009/0279273 A1 Nov. 12, 2009 (30) Foreign Application Priority Data May 12,2008 (JP) ............................... .. 2008-124723 (51) Int. Cl. H05K 1/00 (2006.01) (52) U.S. Cl. ...................................... .. 361/749; 361/795 (58) Field of Classification Search ................ .. 174/254, 174/255, 260, 378; 29/840, 829; 361/749, 361/795 See application file for complete search history. (56) References Cited U.S. PATENT DOCUMENTS 6,288,343 B1* 9/2001 Ahn et al. ................... .. 174/254 6,444,921 B1* 9/2002 Wang et al. .. .... .. 174/260 2009/0188712 A1* 7/2009 Clark et al. ................. .. 174/378

FOREIGN PATENT DOCUMENTS

EP 1 768 470 A1 3/2007

JP 6-320671 A 11/1994

JP 2002-517898 A 6/2002

JP 2005-353827 A 12/2005

TW 1260359 B 8/2006

WO 99/63552 A1 12/1999 OTHER PUBLICATIONS

Foreign Associate letter dated Oct. 20, 2011, summarizing Taiwanese Office Action dated Sep. 27, 2011, issued in corresponding Taiwanese Patent Application No. 97150046.

Taiwanese Office Action dated Sep. 27, 2011, issued in corresponding Taiwanese Patent Application No. 97150046.

* cited by examiner

Primary Examiner * Yuriy Semenenko (74) Attorney, Agent, or Firm * Westerrnan, Hattori, Daniels & Adrian, LLP

(57) ABSTRACT

There is provided a multi-layer printed wiring board that can perform impedance control, concurrently maintaining the flexibility of a flexible portion with one or more signal lines. Such a multi-layer printed wiring board includes a plurality of rigid board units; and a flexible board unit, connecting outer layers or inner layers of the plurality of rigid board units and extending over the outer layers or the inner layers of the plurality of rigid board units. The flexible board unit includes a signal layer sending signals between the plurality of rigid board units; ground layers sandwiching the signal layer; and intermediate layers each interposed between the signal layer and one of the ground layers.

12 Claims, 9 Drawing Sheets