Processor and power supply circuit

(54) PROCESSOR AND POWER SUPPLY CIRCUIT

(75) Inventors: Stuart C. Haden, Lucas, TX (US);

Shaun L. Harris, McKinney, TX (US);
Michael C. Day, Allen, TX (US); Lisa
Heid Pallotti, Piano, TX (US)

(73) Assignee: Hewlett-Packard Development

Company, L.P., Houston, TX (US)

( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.

(21) Appl. No.: 09/560,794

(22) Filed: Apr. 28, 2000

(51) Int. CI.7 H01R 12/04; H05K 1/11

(52) U.S. CI 174/262; 174/260; 174/255

(58) Field of Search 174/255, 254,

174/257, 200, 262-266; 361/792

(56) References Cited

U.S. PATENT DOCUMENTS

5,527,998 A * 6/1996 Anderson et al 174/255

5,912,809 A * 6/1999 Steigerwald et al 174/255

5,926,377 A * 7/1999 Nakao et al 174/255

6,201,194 Bl * 3/2001 Lauffer et al 174/264

6,208,501 Bl * 3/2001 Ingalls et al 361/303

6,252,177 Bl * 6/2001 Stoddard 174/260

6,329,610 Bl * 12/2001 Takubo et al 174/255

6,337,798 Bl * 1/2002 Hailey et al 174/250

OTHER PUBLICATIONS

U.S. patent application Ser. No. 09/548,464 filed Apr. 13, 2000 for Power Management System for Device With Hot-Swapable Components of Koerber et al.

* cited by examiner

Primary Examiner—David L. Talbott
Assistant Examiner—-Jeremy Norris

(57) ABSTRACT

A high performance processor assembly is electrically connected to a power supply so as to minimize voltage variations associated with the supply of power to the processor assembly. The processor assembly is fabricated on a multilayered printed circuit board. Power is supplied to components on the printed circuit board by way of parallel and split power planes. The parallel and split power planes reduce inductance and increase capacitance associated therewith. The reduced inductance reduces voltage variations caused by load transient currents. Capacitors are electrically connected to the power planes by way of multiple vias to further reduce inductance.

13 Claims, 9 Drawing Sheets