Inventors: Toshiaki Suzuki; Yoji Murakami;
Masao Kobayashi; Osamu Yamauchi,
all of Aizuwakamatsu, Japan
[73] Assignee: Fujitsu Limited, Kawasaki, Japan
[21] Appl. No.: 314,793
[22] Filed: Feb. 24, 1989
[30] Foreign Application Priority Data
Feb. 24, 1988 [JP] Japan 63-042815
[51] Int. a.5 H01L 23/48; H01L 23/54
[52] U.S. a 357/70; 357/68
[58] Field of Search 357/70, 68
[56] References Cited
U.S. PATENT DOCUMENTS
4,721,993 1/1988 Walter 357/70
FOREIGN PATENT DOCUMENTS
0012573 1/1977 Japan 357/70
0005557 1/1986 Japan 357/70
A lead frame includes an outside frame portion having an central opening, and a rectangular mount portion supported by the outside frame portion and disposed within the central opening, and on which an electronic element is adapted to be mounted. The lead frame also includes at least one lead element array disposed along a side of the mount portion, respectively, the lead elements included in the array being connected to each other by a common tie bar element, and at least two expandable tie bar elements extending between the outside frame portion and each of the lead element arrays to support each lead element array by the outside frame portion, each of the expandable tie bar elements including a shaped portion which can be expanded by a deformation thereof. In a method of producing an electronic component using the lead frame, a process of bending the lead elements is performed before an electrolyticplating process thereof.
3 Claims, 5 Drawing Sheets
