(12) United States Patent (io) Patent No.: US 6,994,897 B2
Durocher et al. (45) Date of Patent: Feb. 7,2006
(54) METHOD OF PROCESSING
HIGH-RESOLUTION FLEX CIRCUITS WITH
(75) Inventors: Kevin Matthew Durocher, Waterford,
NY (US); Christopher James
Kapusta, Duanesburg, NY (US);
Mehmet Arik, Niskayuna, NY (US);
Richard Joseph Saia, Niskayuna, NY
(US); Piet Moeleker, Latham, NY (US)
(73) Assignee: General Electric Company,
Niskayuna, NY (US)
( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 180 days.
(21) Appl. No.: 10/295,545
(22) Filed: Nov. 15, 2002
(65) Prior Publication Data
US 2004/0094329 Al May 20, 2004
(51) Int. CI.
A47G 1/12 (2006.01)
(52) U.S. CI 428/14; 428/209; 428/901
(58) Field of Classification Search 428/209,
See application file for complete search history.
A mechanism and a method for framing a low-distortion flexible dielectric substrate during subsequent flex circuit processing. The processing method comprising the following steps: making a flexible dielectric substrate having an outer periphery; joining a continuous portion of the flexible dielectric substrate near the outer periphery to a rigid open frame, the flexible dielectric substrate being in a state other than a state of substantially uniform tension as a result of the joinder; causing the joined flexible dielectric substrate to undergo a change to the state of substantially uniform tension; and printing an electrical conductor on the flexible dielectric substrate while the flexible dielectric substrate is joined to the frame and in the state of substantially uniform tension. The frame is in the shape of a polygon (e.g., a rectangle) with rounded vertices.
12 Claims, 2 Drawing Sheets