US 7,733,661 B2 Jun. 8, 2010
CHIP CARRIER AND FABRICATION
METHOD
Inventors: Dean Paul Kossives, Glen Gardner, NJ
(US); Byung Joon Han, Singapore (SG)
Assignee: Stats Chippac Ltd., Singapore (SG)
Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
Appl.No.: 12/393,034
Filed: Feb. 25, 2009
Prior Publication Data
US 2009/0161330 Al Jun. 25, 2009
Related U.S. Application Data
Continuation of application No. 11/877,613, filed on Oct. 23, 2007, now Pat. No. 7,525,812.
Int. CI.
H0SK 7/00 (2006.01)
U.S. CI 361/760; 174/260
Field of Classification Search 361/760,
361/763, 764, 766, 767, 782, 883; 174/260,
174/262, 263 See application file for complete search history.
References Cited
U.S. PATENT DOCUMENTS
A substrate having a ground plane, a first side, and a second side is provided. A via that electrically connects the first side to the second side is formed. A printed wire is formed on the first side, and a printed wire is formed on the second side. A passive component is formed on the first side. The passive component is formed free of the ground plane. An active component is attached to the first side.
14 Claims, 8 Drawing Sheets
