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Patent

  

United States Patent [w]

Havey et al.

[54] HEAT SPREADER SYSTEM FOR COOLING HEAT GENERATING COMPONENTS

[75] Inventors: Mort L. Havey, Dallas; William

Robert Hitch, Garland, both of Tex.

[73] Assignee: Raytheon Company, Lexington, Mass.

[21] Appl. No.: 08/848,998 [22] Filed: May 2, 1997

Related U.S. Application Data

[60] Provisional application No. 60/064,857, Apr. 18, 1997.

[51] Int. CI. H05K 7/20

[52] U.S. CI 361/699; 62/64; 62/259.2;

165/80.4; 174/15.1; 361/695

[58] Field of Search 62/64; 165/80.4,

165/104.33, 903, 908; 174/15.1; 257/714;

361/688-689, 698-699

[56] References Cited

U.S. PATENT DOCUMENTS

2,845,472 7/1958 Narbutovskih 174/15

3,004,406 10/1961 Foote et al 62/373

3,339,373 9/1967 Mobius et al 62/64

3,801,241 4/1974 Martin et al 418/152

4,056,949 11/1977 Hahn 62/373

4,111,614 9/1978 Martin et al 417/420

4,127,365 11/1978 Martin et al 417/420

4,129,845 12/1978 Benke 174/15.1

4,163,164 7/1979 Pieters 310/103

4,165,206 8/1979 Martin et al 417/310

4,276,570 6/1981 Benke et al 174/15.1

4,371,149 2/1983 Takeuchi et al 266/90

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[ii] Patent Number: 5,943,211 [45] Date of Patent: Aug. 24,1999

4,407,136 10/1983 de Kanter .

4,493,625 1/1985 Pieters 418/126

4,711,431 12/1987 Viannay 266/114

4,846,641 7/1989 Pieters 418/70

5,096,390 3/1992 Sevrain et al 417/420

5,131,233 7/1992 Cray et al 62/64

5,220,804 6/1993 Tilton et al 62/64

5,311,931 5/1994 Lee .

Primary Examiner—Gregory Thompson
Attorney, Agent, or Firm—Baker & Botts, L.L.P.

[57] ABSTRACT

An isothermal equilibrium system takes point sources of heat generated by the operation of heat generating components and spreads the heat throughout the system where the heat may be dissipated. An atomizer for atomizing a liquid coolant, is positioned inside a sealed housing. The atomized liquid coolant is distributed as a thin film over the surface of the heat generating components and the wall of the sealed housing. Heat is transferred from the surface of the heat generating components by vaporization of at least a portion of the thin film of liquid coolant. The coolant vapor condenses on the housing and other cool surfaces and returns to the liquid state. The system heat is then removed from the outer surfaces of the housing using conventional heat transfer mechanisms including free or forced air convection and/or circulation of liquid coolant over the exterior of the housing. If additional cooling is desired, heat exchanger tubes may be included inside the sealed housing. An input liquid or gaseous coolant is circulated through the exchanger tubes. Heat is transferred to the coolant and then conducted away from the heat generating component housing.

8 Claims, 6 Drawing Sheets

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