A method for making a semiconductor package firstly provides a lead frame having a first surface and a corresponding second surface. The lead frame includes at least a package unit that further includes a die pad, and a plurality of leads disposed on the periphery of the die pad where each of the leads...http://www.google.se/patents/US6355502?utm_source=gb-gplus-sharePatent US6355502 - Semiconductor package and method for making the same
