A method of making a molded heat sink for plastic packages constructed for housing semi-conductor devices. Heat is removed from the semiconductor device by direct heat transfer from the device through upstanding members integrally molded in the top of the plastic housing. The integrally molded heat dissipation...http://www.google.se/patents/US5254500?utm_source=gb-gplus-sharePatent US5254500 - Method for making an integrally molded semiconductor device heat sink
