A process for producing a plurality of metallized vias in a polyimide dielectric is disclosed. The process includes depositing a polyimide precursor, then a silane and finally a metal, after patterning the polyimide and silane. The sandwich is heated to completely imidize the polyimide, crosslink the...http://www.google.se/patents/US5552638?utm_source=gb-gplus-sharePatent US5552638 - Metallized vias in polyimide
