A semiconductor package is disclosed, such as QFN, SON. The semiconductor package includes a die, a package body for protection of a die, and a plurality of leads. A metal pad formed by some partial downside surface of each lead is located on a downside surface of the package body with coplanarity. Each...http://www.google.se/patents/US6437429?utm_source=gb-gplus-sharePatent US6437429 - Semiconductor package with metal pads
