A device includes a submount, and a semiconductor light emitting device mounted on first and second conductive regions on a first side of the submount in a flip chip architecture configuration. The submount has third and fourth conductive regions on a second side of the submount. The third and fourth...http://www.google.se/patents/US20050023548?utm_source=gb-gplus-sharePatent US20050023548 - MOUNT FOR SEMICONDUCTOR LIGHT EMITTING DEVICE
