The invention provides a method for matching micromirror wafers and electrode wafers so as to form micromirror array devices while the production yield is maximized. Each micromirror wafer and/or electrode wafer may have one or more non-passing dies and a plurality of good dies. A set of matching schemes...http://www.google.se/patents/US7378287?utm_source=gb-gplus-sharePatent US7378287 - Wafer matching methods for use in assembling micromirror array devices
