A laser beam is irradiated onto a photocurable resin layer formed on an electrode part before rearrangement. By scanning the resin on the periphery of a metal wiring formation area extending from the electrode part before rearrangement to a bump electrode contact area, is cured. As a result, a cured...http://www.google.se/patents/US6518664?utm_source=gb-gplus-sharePatent US6518664 - Semiconductor integrated circuit device and manufacturing method of that
