In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler 30. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers...http://www.google.se/patents/US8216672?utm_source=gb-gplus-sharePatent US8216672 - Structured resin systems with high thermal conductivity fillers
