A conductive member is provided on each of electrodes of a semiconductor element. The conductive member is pressed into a shape having a height of approximately two-thirds of the original height to provide a bump. The semiconductor element is caused to face a substrate having an interconnecting pattern...http://www.google.se/patents/US6881612?utm_source=gb-gplus-sharePatent US6881612 - Method of bonding a semiconductor element to a substrate
