Chip module (20) with a chip carrier (21) and at least one chip (22), wherein the chip carrier is designed as a sheet with a carrier layer (23) of plastics material and a conductor path structure (24) with conductor paths (28), and the chip carrier is connected to the chip with interposition of a filling...http://www.google.se/patents/US6093971?utm_source=gb-gplus-sharePatent US6093971 - Chip module with conductor paths on the chip bonding side of a chip carrier
