Methods and apparatus for improved thermal performance and electromagnetic interference (EMT) shielding in integrated circuit (IC) packages is described. A die-up or die-down package includes a heat spreader cap defining a cavity, an IC die, and a leadframe. The leadframe includes a centrally located...http://www.google.se/patents/US20070200210?utm_source=gb-gplus-sharePatent US20070200210 - Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages
