A method of manufacturing chip scale packages at wafer level, comprising the steps of: a) providing a wafer having an active and a back side surface, the active surface of the wafer having a plurality of scribe lines defining individual chips, and each chip having a plurality of electrodes; b) forming...http://www.google.se/patents/US20010055834?utm_source=gb-gplus-sharePatent US20010055834 - Method of making semiconductor packages at wafer level
