A flow formed encapsulated integrated circuit package (100) includes a printed circuit substrate (160) having upper and lower opposed surfaces and one or more anchor holes (150). The one or more anchor holes (150) have an upper aperture in the upper surface and a lower aperture in the lower surface....http://www.google.se/patents/US5336931?utm_source=gb-gplus-sharePatent US5336931 - Anchoring method for flow formed integrated circuit covers
