A method for cleaning a semiconductor device has the steps of securing a wafer (16) with a modified chuck (11) and applying a cleaning solution (18) to the backside (20) of the wafer (16). The cleaning solution (18) is formulated to remove PTFE from the wafer (16). The cleaning solution (18) is applied...http://www.google.se/patents/US7267726?utm_source=gb-gplus-sharePatent US7267726 - Method and apparatus for removing polymer residue from semiconductor wafer edge and back side
