A method for bonding a LSI chip having terminals on a wiring base having electrodes which comprises the steps of coating a heat sensitive adhesive on the surface of a wafer forming a plurality of LSI chips, sprinkling electrically conductive particles thereon, dopping the electrically conductive particles,...http://www.google.se/patents/US4744850?utm_source=gb-gplus-sharePatent US4744850 - Method for bonding an LSI chip on a wiring base
