A resin sealing type semiconductor device comprises an element mounting member (10) having an element mounting surface (12), a semiconductor element (20) bonded to the element mounting surface (12), a plurality of leads (30) provided and separated from the semiconductor element (20), a frame lead (36)...http://www.google.se/patents/US6133623?utm_source=gb-gplus-sharePatent US6133623 - Resin sealing type semiconductor device that includes a plurality of leads and method of making the same
