A multilayer thin-film wiring board includes a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and includes a via formed by laminating the wiring layers so as to be provided through the insulating layer. A plurality of branching vias are...http://www.google.se/patents/US20010011607?utm_source=gb-gplus-sharePatent US20010011607 - MULTILAYER THIN-FILM WIRING BOARD
