An improved vertical pin probing device is constructed with a housing spaced upper and lower dies of Invar.RTM., which substantially matches the coefficient of thermal expansion of the silicon wafer being probed. Spaced slots in the top and bottom dies of the housing contain inserts of Vespel.RTM.. The...http://www.google.se/patents/US6163162?utm_source=gb-gplus-sharePatent US6163162 - Temperature compensated vertical pin probing device
