A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring...http://www.google.se/patents/US6825062?utm_source=gb-gplus-sharePatent US6825062 - Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant
