In accordance with the present invention, there is provided a semiconductor package (e.g., a QFP package) including a uniquely configured leadframe sized and configured to maximize the available number of exposed leads in the semiconductor package. More particularly, the semiconductor package includes...http://www.google.se/patents/US7875963?utm_source=gb-gplus-sharePatent US7875963 - Semiconductor device including leadframe having power bars and increased I/O
