A method for removal of post reactive ion etch sidewall polymer rails on a Al/Cu metal line of a semiconductor or microelectronic composite structure comprising: 1) supplying a mixture of an etching gas and an acid neutralizing gas into a vacuum chamber in which said composite structure...http://www.google.se/patents/US6849153?utm_source=gb-gplus-sharePatent US6849153 - Removal of post-rie polymer on A1/CU metal line
