A non-leaded integrated circuit package system is provided providing a die paddle of a lead frame, forming a dual row of terminals including an outer terminal and an inner terminal, and selectively fusing an inner terminal and an adjacent inner terminal to form a fused lead....http://www.google.se/patents/US8003443?utm_source=gb-gplus-sharePatent US8003443 - Non-leaded integrated circuit package system with multiple ground sites
