A solder paste stencil printing apparatus and method for applying a controlled pattern and volume of solder paste onto a single area array component site on a populated printed circuit board (PCB). The stencil is a disposable, adhesive-backed, flexible, polymer membrane. The stencil has a plurality of...http://www.google.se/patents/US6253675?utm_source=gb-gplus-sharePatent US6253675 - Solder paste stenciling apparatus and method of use for rework
