A quad flat no-lead (QFN) grid array semiconductor package and method for making the same is disclosed. The package includes a semiconductor die and a lead frame having a plurality of conductive elements patterned in a grid-type array. A plurality of bond pads on the semiconductor die is coupled to the...http://www.google.se/patents/US7109572?utm_source=gb-gplus-sharePatent US7109572 - Quad flat no lead (QFN) grid array package
