Laser system and method for material processing with ultra fast lasers are provided. One aspect of the invention features the method which removes at least a portion of a target structure such as a memory link while avoiding undesirable damage to adjacent non-target structures. The method includes applying...http://www.google.se/patents/US20040226925?utm_source=gb-gplus-sharePatent US20040226925 - Laser system and method for material processing with ultra fast lasers
