A power lead and a ground lead are connected to corresponding pads of a die through an intra-package wiring substrate. A ground plane is formed in a mold under the intra-package wiring substrate extending along the bottom surface of the mold, and connected to the ground lead. A decoupling capacitor is...http://www.google.se/patents/US6803655?utm_source=gb-gplus-sharePatent US6803655 - Semiconductor integrated circuit device with EMI prevention structure
