A plating method and apparatus using contactless electrode is described. In one embodiment an inductive element is placed proximally to a substrate and a moving electromagnetic field generates an emf in the substrate to plate the surface. In another embodiment, a conductive plate is used, so that the...http://www.google.se/patents/US6855239?utm_source=gb-gplus-sharePatent US6855239 - Plating method and apparatus using contactless electrode
