Methods are provided for making plated through holes usable for inserting and attaching connector probes. In a first method, a curved plated through hole is formed by bonding curved etchable wires to a first substrate, plating the wires with a non-etchable conductive material, encasing the plated wires...http://www.google.se/patents/US7024763?utm_source=gb-gplus-sharePatent US7024763 - Methods for making plated through holes usable as interconnection wire or probe attachments
