Systems and methods for depositing conductive material into openings in microfeature workpieces are disclosed herein. One particular embodiment of a system for processing microfeature workpieces includes a processing chamber and a solder reservoir in the processing chamber. The solder reservoir includes...http://www.google.se/patents/US20070057028?utm_source=gb-gplus-sharePatent US20070057028 - Systems and methods for depositing conductive material into openings in microfeature workpieces
