The present invention provides a system and method for employing leaded packaged memory devices in memory cards. Leaded packaged ICs are disposed on one or both sides of a flex circuitry structure to create an IC-populated structure. In a preferred embodiment, leads of constituent leaded IC packages...http://www.google.se/patents/US7605454?utm_source=gb-gplus-sharePatent US7605454 - Memory card and method for devising
