Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that these types of spring probe structures can be used to test one or more integrated circuits on a semiconductor...http://www.google.se/patents/US6917525?utm_source=gb-gplus-sharePatent US6917525 - Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
