Methods and apparatuses for encapsulating a microelectronic die or other components in the fabrication of packaged microelectronic devices. In one aspect of the invention, a packaged microelectronic device assembly includes a microelectronic die, a substrate attached to the die, a protective casing covering...http://www.google.se/patents/US6838760?utm_source=gb-gplus-sharePatent US6838760 - Packaged microelectronic devices with interconnecting units
