The electrical contacts, such as ball grid array (BGA) solder balls, of an integrated circuit are coupled to printed circuit board (PCB) bonding pads that include vias. According to one embodiment of an electronic assembly, the vias are formed off-center, so as to inhibit bridging between adjacent solder...http://www.google.se/patents/US6833615?utm_source=gb-gplus-sharePatent US6833615 - Via-in-pad with off-center geometry
