The invention includes a semiconductive processing method of electrochemical-mechanical removing at least some of a conductive material from over a surface of a semiconductor substrate. A cathode is provided at a first location of the wafer, and an anode is provided at a second location of the wafer....http://www.google.se/patents/US6582281?utm_source=gb-gplus-sharePatent US6582281 - Semiconductor processing methods of removing conductive material
