A wafer clamping apparatus is provided to secure a wafer within a chamber during wafer processing. The wafer clamping apparatus creates a pressure differential between a top surface and a bottom surface of the wafer. The pressure differential serves to pull the wafer toward a wafer support structure...http://www.google.se/patents/US20040187894?utm_source=gb-gplus-sharePatent US20040187894 - Wafer clamping apparatus and method for operating the same
