An LED package, made of ceramic substrates and having a reflective metal plate, is disclosed. This LED package consists of a first ceramic substrate, which has a chip mounting area on its top surface, and is provided with a predetermined conductive pattern formed around the chip mounting area. One or...http://www.google.se/patents/US20030116769?utm_source=gb-gplus-sharePatent US20030116769 - Light emission diode package
