A heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip. The inventive device includes a first membrane of flexible, thermally conductive material having a first surface in contact with the integrated circuit chip. A flexible, thermally conductive radial...http://www.google.se/patents/US5270902?utm_source=gb-gplus-sharePatent US5270902 - Heat transfer device for use with a heat sink in removing thermal energy from an integrated circuit chip
