A method for attaching bumped semiconductor dice to substrates, such as printed circuit boards and multi chip modules, is provided. The method includes the steps of: providing an instant curing adhesive formulated to cure within 0.25 to 60 seconds, and dispensing a volume of the adhesive onto the substrate....http://www.google.se/patents/US6221691?utm_source=gb-gplus-sharePatent US6221691 - Method and system for attaching semiconductor dice to substrates
