In a semiconductor inner lead bonding process, a connection component having leads is disposed on the chip surface so that the leads lie above the contacts. A bond region of each lead is forced downwardly by a tool into engagement with a contact on the chip while a first or proximal end of the lead remains...http://www.google.se/patents/US5398863?utm_source=gb-gplus-sharePatent US5398863 - Shaped lead structure and method
