A semiconductor package substrate (10) has an array of package sites (13,14,16,21,22, and 23) that are substantially identical. The entire array of package sites (13,14,16,21,22, and 23) is covered by an encapsulant (19). The individual package sites (13,14,16,21,22, and 23) are singulated...http://www.google.se/patents/US5776798?utm_source=gb-gplus-sharePatent US5776798 - Semiconductor package and method thereof
