Microelectronic device assemblies are provided with reduced-thickness dies. In certain methods of the invention, a die is connected to a mounting surface of a support and the back surface of the die is ground to reduce the die thickness. In certain embodiments, a portion of the mounting surface of the...http://www.google.se/patents/US6548376?utm_source=gb-gplus-sharePatent US6548376 - Methods of thinning microelectronic workpieces
