A wire bonding method, a bump forming method and a bump which are capable of preventing contact of a wire with a substrate or a conductive lead after the wire is bonded to a bump, and which are capable of preventing generation of bending in the wire during bonding of the wire to the bump are disclosed....http://www.google.se/patents/US6715666?utm_source=gb-gplus-sharePatent US6715666 - Wire bonding method, method of forming bump and bump
